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China Leads Hand Soldering World Championship
January 21, 2026 | Philippe Leonard, Global Electronics AssociationEstimated reading time: 2 minutes
Regional champions from around the world gathered excitedly at productronica in Munich this past November with one goal: to be crowned the world hand-soldering champion by the Global Electronics Association.
Hand soldering is a significant process in printed circuit board assembly. Adhering to procedures, standards, and best practices enables the production of high-quality and reliable solder joints.
After two days of competition, the 15 regional champions from 12 countries completed a complex circuit board assembly in accordance with IPC-A-610 Class 3 criteria. The assemblies were judged on functionality, process compliance, and overall product quality. Participants were given a maximum of 60 minutes to complete the assembly.
Contestants came from the following countries: Saudi Arabia, Estonia, France, Australia, China, Italy, the United Kingdom, Japan, Mexico, Vietnam, Thailand, and Hungary.
Taking top honors in the 2025 Hand Soldering World Championship were:
First Place: Ms. Yan Yang, ZhuZhou CRRC Times Electric Co. (China), who scored 871 out of a maximum possible of 887 points
Second Place: Ms. Eva Gobet, Thales Six GTS (France), who scored 843 out of 887 points maximum possible
Third Place: Mr. Peter Richard Zsombok, BHE Bonn Hungary Elektronik KFT (Hungary), with a final score of 840 out of 887 points maximum possible
“The Global Electronics Association extends its thanks and congratulations to all the participants, companies, judges, and staff for their invaluable support and expertise throughout the competition week,” said Philippe Leonard, Europe director, Global Electronics Association. “We look forward to an exciting year, marked by the 2026 HSC Qualification Rounds and the introduction of a new competition variant: the CWH-Cable and Wire Harness Competition, which will begin in Europe in February 2026.”
Gold sponsors were Weller Tools and JBC Soldering. Silver sponsors were Optilia, Almit, Group ACB, Polygone CAO, Davum TMC, SFM – Société Française de Microscopie.
To view our photo gallery from the event, visit the January 2026 SMT007 Magazine, here.
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Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.