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Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation

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Flex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing.

OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics

04/22/2026 | OE-A
With the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.

Bosch Executive Erik Rein Elected New President of ESIA

04/21/2026 | ESIA
On 20 April 2026, the General Assembly of the European Semiconductor Industry Association (ESIA) gathered to elect Erik Rein, Executive Vice President and Board Member Mobility Electronics responsible for semiconductor business at Bosch, as the organisation’s new President.

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Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards

04/17/2026 | Real Time with... APEX EXPO
At APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
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