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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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The Signal Integrity Issue: Design007 Magazine September 2025
September 9, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
During the dotcom boom, SI seemed a lot like black magic. Until then, PCBs ran at such low speeds, and rise and fall times were so long, that designers didn’t have to worry about “analogish” behavior. You could ballpark it and get away with it.
Today’s PCB designers have far more weapons to wield in their fight for SI than they did in 1999. That’s a good thing, because almost everything on a board is faster, smaller, and more complex than a few decades ago. As the saying goes, “If you don’t have signal integrity problems now, you will eventually.”
This month in the September issue of Design007 Magazine, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.
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Sweeney Ng - CEE PCBSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/15/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
ASC Sunstone Circuits to Exhibit at PCB East 2026
04/26/2026 | ASC Sunstone CircuitsAnaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.
Target Condition: When Design Outpaces Manufacturing
04/23/2026 | Kelly Dack -- Column: Target ConditionMost PCB designers already understand why design for manufacturing (DFM) matters. If a product can’t be built reliably, repeatedly, and at a price anyone will actually pay, it’s dead on arrival. You may have the most elegant schematic and layout ever drawn in a CAD tool, but if the PCB suppliers can’t make it, or the EMS sources refuse to quote it, you may well be considered more of a Nutty Professor or well-meaning inventor than a PCB designer.
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.