The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
August 18, 2025 | Nordson Electronics SolutionsEstimated reading time: Less than a minute
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.
On display will be the ASYMTEK Vantage dispensing system, configured with two ASYMTEK IntelliJet jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today’s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations.
The theme for SEMICON Taiwan 2025, “Leading with Collaboration. Innovating with the World,” will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.