Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

Qnity Receives Zhen Ding 2026 Distinguished Contribution Award

07/27/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it has received the 2026 Distinguished Contribution Award by Zhen Ding Technology Group, one of the world’s leading printed circuit board manufacturers.

Qnity Unveils Sustainability Goals to Power the Next Era of Advanced Electronics

07/13/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its sustainability goals, measurable commitments designed to advance sustainable innovation across the semiconductor and advanced electronics industry.

Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions

06/23/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company.

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

06/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in