-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
July 15, 2025 | KONIGEstimated reading time: 1 minute

KONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
KONIG specializes in both Low Pressure Injection Molding Solutions and 3D Digital Packaging Protection Solutions, working alongside customers to build high-quality, high-reliability electronic products. The KP400 is KONIG’s latest innovation in digital conformal coating—offering a fully automated, image-based application process designed to protect complex assemblies such as PCBA, FPC, and mini-LEDs.
Unlike traditional spray or molding processes, the KP400 uses advanced 3D printing technology to apply protective coatings with picoliter-level droplet control. Equipped with over 1,000 independently controlled nozzles, the system deposits coating with up to 400 dpi resolution and layer precision as fine as 15 microns. Image recognition software enables real-time area mapping and full-board processing in a single pass—eliminating the need for masking, shielding, or multiple dispensing cycles.
Integrated UV curing ensures immediate hardening of materials, further accelerating production and removing the need for solvent-based post-processing. The KP400 is also optimized for solvent-free, UV-curable materials that offer excellent thermal resistance, dielectric strength, and mechanical durability.
Designed for efficiency and sustainability, the KP400 dramatically reduces material waste—by as much as one-thirds—while streamlining production workflows and lowering labor requirements. With fewer steps, faster throughput, and easy integration into existing SMT lines, the KP400 supports significant cost savings and improved manufacturing uptime. Its modular print head also enables quick nozzle replacement and simplified maintenance.
“The KP400 brings a modern, software-driven approach to conformal coating, giving manufacturers greater control over their processes and better protection for today’s advanced electronic assemblies,” said Gavin Petersen, Business Development.