Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
Mycronic’s Global Technologies Acquires Surfx in the US
June 3, 2025 | MycronicEstimated reading time: 1 minute
Mycronic’s Global Technologies division has acquired Surfx Technologies, a company headquartered in the US, providing atmospheric plasma solutions for surface treatment, including cleaning and active oxide removal. These solutions are used in advanced packaging, semiconductor processing, and other electronics manufacturing applications.
Surfx provides plasma cleaning engines for integration into semiconductor packaging equipment, such as thermocompression bonders, hybrid bonders and inkjet printers. The company also provides turnkey plasma cleaning and activation systems for these and other industries, including printed circuit board assembly and medical diagnostics device manufacturing. Surfx’s unique edge is that the systems do not require vacuum, making them suitable for integration into inline production lines.
Surfx was founded in 1999. Mycronic made a minor investment in 2020 and previous to the acquisition owned 7.5 percent of the company. Surfx has 34 employees located in the US and Taiwan, with net sales for 2025 projected at USD 25-30 million.
“Surfx has a unique plasma cleaning solution that is gaining traction in 3D semiconductor die stacking, which is one of the critical enabling technologies behind the AI revolution. With this acquisition, Mycronic invests in leading manufacturing equipment for the semiconductor industry”, says Magnus Marthinsson, Sr VP Global Technologies at Mycronic.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.
onsemi Reports Second Quarter 2025 Results
08/05/2025 | onsemionsemi announced its second quarter 2025 results with revenue of $1,468.7 million.
MACOM Completes Transfer of RTP Wafer Fab
08/05/2025 | MACOMMACOM Technology Solutions Holdings, Inc., a leading supplier of semiconductor products, announced it has assumed full operational control of the wafer fabrication facility it purchased, located in Research Triangle Park, North Carolina.
Global Semiconductor Sales Increase 7.8% from Q1 to Q2; Month-to-Month Sales Tick Up 1.5% in June
08/05/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $179.7 billion during the second quarter of 2025, an increase of 7.8% compared to Q1.
iDEAL Signs Technology Partner Agreement for SuperQ MOSFETs with Power System Specialist Richardson Electronics, Ltd.
08/01/2025 | PR NewswireiDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.