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Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference

06/16/2025 | Pete Starkey, I-Connect007
It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/13/2025 | Marcy LaRont, I-Connect007
Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).

Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth

06/12/2025 | Priority Software
Priority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint. 

Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR

06/11/2025 | GlobeNewswire
According to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
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