Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
The Shaughnessy Report: Always With the Negative Waves
Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
epoxySet Introduces EC-1019 – Thermally Conductive, Crack Resistant Epoxy Potting
April 7, 2025 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces the EC-1019, specialized epoxy potting compound. This system utilizes unique chemistry and fillers to offer a thermally conductive compound that has very small particulate size of about 15um. The small particles allow it to penetrate and fill intricate voids. The thermal conductivity of 2.0 W/m°K makes for excellent heat dissipation in temperatures ranges of -40 to 220°C. The unique chemistry drastically reduces cracking compared with traditional, rigid materials. Its low CTE of 22 ppm/°C keeps stresses to a minimum.
It is used for tightly packed windings in motor stators/rotors, transformer coils and power supplies as well as other elaborate potting applications where thermal strain is a concern.
EC-1019 has excellent resistance to moisture and chemicals and is a superior electrical insulator. It is available in quart, gallon and pail kits with supply in about 2 weeks.
Share on:
Suggested Items
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.
IPC APEX EXPO 2025 Review: The New Normal Looks Like the Old Normal
04/16/2025 | Nolan Johnson, SMT007 MagazineMy IPC APEX EXPO, my days are filled with either talking or listening from sunup to sundown. I get to answer questions of some of the brightest minds in the business, while also listening and synthesizing what they’re sharing with me about the current and future state of the industry. Here are five observations based on the conversations.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.
YINCAE to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025
04/16/2025 | YINCAEYINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, is proud to announce its participation in SEMICON Southeast Asia 2025.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.