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Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
April 8, 2025 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design. This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business (SMB) market.
“The acquisition is a significant step for Siemens EDA in the mid-sized PCB market, offering DownStream’s customers improved time to market, quality, and cost efficiency," said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. "Integrating DownStream Technologies enables Siemens EDA to provide the most comprehensive and advanced manufacturing data preparation solution, helping to ensure a smooth transition from design to production within a fully digitalized and scalable electronic systems design process.”
Founded in 2002 and based in Marlborough, Massachusetts, DownStream Technologies is a leading provider of manufacturing solutions for manufacturing data analysis and processing, and documenting PCB designs. Its widely adopted CAM350 suite of tools enables customers to visualize, verify and automatically prepare PCB design data for fabrication.
DownStream’s patented BluePrint-PCB tool is widely recognized as a best-in-class documentation solution enabling customers of all sizes to automate the creation of highly detailed manufacturing documents. By reducing errors and streamlining the transition from design to production, BluePrint-PCB enhances efficiency across the PCB development process. The integration of BluePrint-PCB with Siemens’ PCB design solutions aims to provide customers with a seamless workflow, improving digital continuity and manufacturing readiness.
“We’re excited to join forces with Siemens and bring our decades of expertise into their world-class ecosystem,” said Rick Almeida, founder, DownStream Technologies. “Together, we’ll provide a fully integrated solution with both breadth and depth that enables PCB designers to deliver designs to manufacturing with greater efficiency and confidence.”
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Automation Meets Sustainability
09/08/2025 | Rick Nichols, GreenSource EngineeringGreenSource Engineering (GSE) is proud to have contributed to the first successful reshoring of a PCB facility on a greenfield site in the United States. While we are honored to have played a key role, full credit for this achievement goes to SEL for its vision, commitment, and professionalism.
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/04/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.