Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Observations on Palladium as a Final Finish

04/04/2025 | Happy Holden, I-Connect007
Not much has been published about palladium as a final finish, but it’s experiencing a renaissance as a liquid metal for metallization of copper in ultra HDI and as a final finish. It was very popular in the 1970s because of its corrosion resistance, as the only other final finishes were tin-lead reflow, Ni/Au, OSP, or immersion tin. Palladium was very popular with the automotive industry then and Photocircuits of Glen Cove, New York, was a major supplier of boards.

Uyemura Announces Six Sigma Graduates

04/02/2025 | Uyemura
Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.

Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.

SAMI-AEC Earns Gold Membership Under “Made in Saudi” Program

03/19/2025 | SAMI
SAMI Advanced Electronics Company (SAMI-AEC) proudly announces its elevation to the prestigious Gold Category within the “Made in Saudi” program.

ICT Spring Seminar: Nickel Not Welcome Here

03/12/2025 | Pete Starkey, I-Connect007
After a miserable, dull, and damp English winter, a really pleasant nearly spring day with the sun shining and daffodils in bloom greeted delegates to the Institute of Circuit Technology Spring Seminar at Puckrup Hall near Tewkesbury, March 5, in Gloucestershire, UK.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in