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Delvitech Expands Into Microelectronics and Chiplet Segments

01/23/2025 | Delvitech
Delvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.

iNEMI and MIT Conduct Survey on Optical Adhesives for High-Volume Photonics

01/21/2025 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

ViTrox Appoints Marco Liu as Senior Sales Manager in the Taiwan Region

01/16/2025 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce the appointment of Marco Liu as the Senior Sales Manager of ViTrox in the Taiwan region, effective December 17, 2024.

Imec Achieves Breakthrough in Silicon Photonics

01/13/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
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