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The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability

01/30/2025 | Stephen V. Chavez, Siemens EDA
The global demand for electronics is skyrocketing, fueled by rapid technological advancements and groundbreaking innovations across many industries, including automotive, telecommunications, healthcare, and consumer electronics. PCB design is the foundation of electronic hardware and lies at the heart of this evolution.

Istvan Novak Looks Back on History of DesignCon

01/29/2025 | Andy Shaughnessy, Design007 Magazine
Many of us have been attending DesignCon for a long time, but Samtec’s Istvan Novak has been attending DesignCon even before it was called DesignCon. A veteran signal and power integrity engineer, Istvan has been on the Technical Program Committee for over two decades, and he’s authored and co-authored a variety of award-winning conference papers. In honor of the show’s 30th anniversary, I asked Istvan to share a little about the early years of DesignCon, and how he got involved with the event.

SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design

01/29/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.

SMTA UHDI Symposium 2025, Part 2: State of the Art

01/29/2025 | Marcy LaRont, I-Connect007
A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.

SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions

01/28/2025 | Marcy LaRont, I-Connect007
SMTA hosted its second annual Ultra High Density Interconnect Symposium, a conference on cutting-edge PCB technology, on Jan. 23, 2025, at the Peoria Sports Complex in Arizona. A highly pro-business state with a special affection for the tech sector, Arizona is home to the biggest Intel semiconductor fab in the United States and the new TSMC chip fab. With an intimate group of approximately 50 attendees, the SMTA event offered a great forum for learning, interactive discussion, and networking.
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