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I-Connect007 Releases The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs by Martyn Gaudion
January 29, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, authored by Martyn Gaudion of Polar Instruments. This invaluable resource offers essential insights for anyone involved in the design, procurement, or fabrication of high-speed impedance or insertion loss-controlled PCBs, as well as complex HDI PCBs requiring precise documentation.
A new addition to the acclaimed Printed Circuit Designer’s Guide to… series, this book builds on the principles introduced in Secrets of High-Speed PCBs, Parts 1 and 2. It provides readers with a comprehensive understanding of the challenges in transitioning designs from CAD/CAM systems to real-world manufacturing, where materials, processes, and tolerances often defy idealized specifications.
Key topics covered include:
- Strategies for bridging the gap between design precision and manufacturing realities.
- Best practices for documentation to ensure seamless PCB fabrication.
- Methods to improve signal integrity through precise measurement and modeling.
Written for PCB designers, engineers, and procurement teams, this guide emphasizes how to transition quality designs from prototype to production while maintaining the highest signal integrity standards. With Gaudion’s expertise and practical advice, readers will gain a deeper understanding of the interplay between design specifications and the complex realities of manufacturing processes.
Available Now! Discover how to elevate your PCB design and fabrication process. Learn more and download your copy here.
I-Connect007’s Printed Circuit Designer’s Guide to… series is a trusted collection of educational resources tailored for printed circuit board industry professionals. Equip yourself with the knowledge to design and deliver exceptional high-speed PCBs.
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The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability
01/30/2025 | Stephen V. Chavez, Siemens EDAThe global demand for electronics is skyrocketing, fueled by rapid technological advancements and groundbreaking innovations across many industries, including automotive, telecommunications, healthcare, and consumer electronics. PCB design is the foundation of electronic hardware and lies at the heart of this evolution.
Istvan Novak Looks Back on History of DesignCon
01/29/2025 | Andy Shaughnessy, Design007 MagazineMany of us have been attending DesignCon for a long time, but Samtec’s Istvan Novak has been attending DesignCon even before it was called DesignCon. A veteran signal and power integrity engineer, Istvan has been on the Technical Program Committee for over two decades, and he’s authored and co-authored a variety of award-winning conference papers. In honor of the show’s 30th anniversary, I asked Istvan to share a little about the early years of DesignCon, and how he got involved with the event.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
01/29/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
SMTA UHDI Symposium 2025, Part 2: State of the Art
01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.
SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions
01/28/2025 | Marcy LaRont, I-Connect007SMTA hosted its second annual Ultra High Density Interconnect Symposium, a conference on cutting-edge PCB technology, on Jan. 23, 2025, at the Peoria Sports Complex in Arizona. A highly pro-business state with a special affection for the tech sector, Arizona is home to the biggest Intel semiconductor fab in the United States and the new TSMC chip fab. With an intimate group of approximately 50 attendees, the SMTA event offered a great forum for learning, interactive discussion, and networking.