The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
The Future of Electronics Manufacturing in APAC
January 30, 2025 | Daniel Schmidt, MKS' ATOTECHEstimated reading time: 1 minute
The Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Transforming Electronics Manufacturing
The electronics industry's shift to 3D heterogeneous integration—assembling chips on organic substrates—is driving demand for new materials, processes, and technologies. This innovation, combined with the industry's increasing presence in APAC, leverages the region's robust manufacturing capabilities and investment opportunities, positioning it for substantial growth.
Meeting the Challenges of Advanced Technologies
The rise of AI, renewable energy systems, and autonomous vehicles has created a demand for components that are faster, smaller, and capable of handling immense data loads. Essential for miniaturization and high-speed applications, next-generation technologies using electrochemical deposition for advanced semiconductor packaging, semi-additive processing (SAP) for package substrates, or modified SAP (mSAP) at the printed circuit board level enable the much finer feature sizes required for increased density and fast signaling. In addition, advanced materials such as glass substrates are contributing to this trend, enabling finer feature sizes with improved signal integrity, which is critical for high-performance systems.
Read the rest of this article in the January 2025 issue of PCB007 Magazine.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.