-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 10, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 3 minutes

“Baby, it’s cold outside!” Though certain holiday tunes are still lingering in my head, we are indisputably in the new year. For our companies, we are just warming up (pun intended) for the year as, for the first time in nearly two months, all of us are finally back in the office. So, let the productivity (re)commence.
In the past couple of weeks, we’ve had some big industry news. In the automotive world, Honda and Nissan merged to form the largest car manufacturer in Japan. Before President Biden left office, he made sure to distribute more CHIPS Act money to bring some measure of electronics manufacturing back to the U.S. And former President Jimmy Carter died at the age of 100 and was honored on Thursday, reminding us all what true integrity looks like.
For the electronics manufacturing industry, here are my must-reads for the week.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Published January 7
Vern Solberg’s column seems a fitting article to feature, highlighting the impact of semiconductor packaging requirements on the printed circuit board, and advising PCB designers on the best way to approach their delicate work given the many requirements in front of them. Not surprisingly, he spends a fair amount of time talking about stackups and the need (or not) to work with the fabrication facility, but also highlights that most CAD tools now offer the ability for designers to provide a stackup to the fabricator, though it may well change in the fabricator’s hands. If you are a PCB designer, or a fabricator looking for a better understanding of the designers providing you with data, take a few minutes for this read.
Expansion, Retirement, and New Leadership at FCT
Published January 9
Flexible circuit board supplier Flexible Circuit Technologies (FCT)’s Carey Burkett talks about his company’s plans as they enter a new year. He has announced his eventual retirement and brought EMS professional Ray Cottrell into the FCT fold to transition into Carey’s role and develop FCT’s EMS and inTflex integrated solutions offering to customers. Their enthusiasm and passion were evident throughout our interview. I will be watching to see all they accomplish in 2025 and beyond.
EMS Providers Should ‘Plan Prudently’ in 2025
Published January 8
In his interview with Dennis Reed of Edgewater Research and IPC’s Mark Wolfe, Nolan Johnson tackles the question as to what EMS providers should plan for in 2025. He cites such situations as the change in the U.S. administration, tariffs, how company spending will be affected by economics, nearshoring and the relationship between China and the West, industry competition, supply chains, and more. This is a great market outlook piece and valuable read.
American Standard Circuits’ Anaya Vardya to Keynote PanPac Summit 2025
Published January 9
Amidst the lineup of winter tradeshows is the PanPac Summit, held each year in Hawaii. This year, the keynote speaker will be Anaya Vardya, CEO of American Standard Circuits (ASC). Anaya has been an innovator in the PCB sector from the moment he joined the industry, and his work in the UHDI space is notable. The keynote takes place Jan. 28 and is titled “Ultra High-Density Interconnects (UHDI): A Global Innovation in Electronics Assembly.”
It’s Only Common Sense: Making 2025 the Best Sales Year Ever
Published January 6
Fan favorite, Dan Beulieu’s column this week is bound to get some attention. As we each embark on 2025, we are all focused on sales and revenue. Given all the economic realities with which we must contend, any wisdom Dan can impart as to how we might make 2025 the best sales year ever are certainly welcome. Dan gives 10 tips to help assure success. It is advice worth heeding.
Marcy LaRont Named I-Connect007 Executive Director
Published January 8
As a bonus sixth item this past week, I want to highlight a significant leadership change at I-Connect007. Barry Matties, who has been an industry publisher since 1986, will remain as executive director for several months as I now succeed him. Barry’s long service to the industry has played a foundational role in setting a standard for electronics manufacturing trade media. As I now lead this organization, I look forward to all that is ahead for I-Connect007 publications and products and continuing to provide you with the highest level of news, technical, and business information you have come to count on. Please know that I welcome your feedback and input. Contact me at marcy@iconnect007.com.
Suggested Items
Four Industry Leaders Receive IPC President’s Award at IPC APEX EXPO 2025
03/21/2025 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, four IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, California, on March 18, 2025.
Compal Launches New High-Performance GPU Server Platforms at GTC 2025
03/20/2025 | PRNewswireAt GTC 2025, Compal Electronics unveiled three new server platforms—SX420-2A, SX220-1N, and SX224-2A. All are built on NVIDIA MGX architecture and designed to inject powerful performance into enterprise-level AI, HPC, and high-load computing applications.
NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base
03/20/2025 | PRNewswireNextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.
TRI at SMTA Monterrey 2025
03/19/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will be participating in the SMTA Monterrey Expo & Tech Forum 2025 at the Cintermex Convention Center on April 10, 2025.
Technica USA Appoints Jason Perry as New President
03/19/2025 | Technica USATechnica USA, a leading provider of materials, equipment, and services for the printed circuit board (PCB) fabrication, assembly, MEMS, and semiconductor industries, is pleased to announce the appointment of Jason Perry as its new President.