Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
iNEMI Connector Footprint Tolerance End-of-Project Webinar
October 24, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.
Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.
Registration
This webinar is open to industry; advance registration is required, click here.
Monday, October 28, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
4:00-5:00 p.m. CET (Europe)
Share on:
Suggested Items
IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President
04/16/2025 | IPCIPC, the global electronics association, announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: EPOCH Expands With Automation
04/17/2025 | Real Time with...IPC APEX EXPOWith a 35-year history, EPOCH is expanding its operations in Bangalore, India, focusing on automation and customer collaboration. Phil Marcoux leads a task force for AI in PCB design, working with various companies to enhance collaboration, and cites that, historically, data sharing has provided the greatest challenge for AI development. Luckily, he says, that is changing. EPOCH combines AI and traditional methods in manufacturing, especially in product design.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.