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Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
April 30, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is excited to share the latest episode in our new podcast series, delivering expert technical insights for the printed circuit board and electronics manufacturing industry.
In On the Line with... NCAB: PCB Thermal Management, host Nolan Johnson turns up the heat with NCAB field application engineer Ryan Miller.
In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
As the industry’s longest-running digital media company, I-Connect007 brings you the content you need—magazines, books, in-depth features, newsletters, podcasts, webinars, and event coverage—to keep you informed and ahead of the curve.
Don’t miss episode two of this insightful series—and be sure to download the free companion guide!
Learn about this and other topics at On the Line with... I-Connect007, Apple, or Spotify today.
Visit our educational resource center to access more free content.
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Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/29/2025 | I-Connect007The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.
Meet the Author Podcast Features Dr. Pritha Choudhury
09/24/2025 | I-Connect007I-Connect007 announces the latest episode of its Meet the Author podcast series, spotlighting Dr. Pritha Choudhury, a co-author of The Printed Circuit Assembler’s Guide to Low-temperature Soldering, Volume 2. In this conversation with SMT007 Managing Editor Nolan Johnson, Dr. Choudhury explains why a second volume was essential and explores the real-world factors accelerating the adoption of low-temperature soldering across the electronics manufacturing industry.