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Avnet Announces Release of Autodesk Fusion Integration
October 16, 2024 | AvnetEstimated reading time: Less than a minute
Design engineers can now access thousands of reference design schematics, lead time and pricing trends, and fast alternate guidance with the launch of the Avnet App, an add-in for Autodesk Fusion.
Avnet is the first to add these design capabilities and insights via a globally available add-in to the Autodesk Fusion solution. The Avnet App will give design engineers access to a powerful part search, alternates library, project cost and supply chain health analysis, datasheets, component symbols and more.
Autodesk Fusion is a cloud-based 3D modeling, CAD, CAM, PCB and mechanical engineering solution for product design and manufacturing. Avnet’s new features are offered as a Fusion add-in to streamline design workflow, helping design engineers meet functional requirements, cost targets, manufacturing goals, and lifecycle timelines.
“As a key technology partner in the early stages of design and product realization, Avnet provides engineers with valuable tools through the app,” said Chris Jackson, VP, Digital Strategy and Innovation, Avnet. “The reference design library is full of schematics and project descriptions that engineers can directly place into their designs with a simple in-app search in as few as three clicks.”
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Rachael Temple - AlltematedSuggested Items
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.