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New Power Management Chips from TI Maximize Protection, Density and Efficiency for Modern Data Centers

03/24/2025 | Texas Instruments
Texas Instruments (TI) debuted new power-management chips to support the rapidly growing power needs of modern data centers. As the adoption of high-performance computing and artificial intelligence (AI) increases, data centers require more power-dense and efficient solutions.

Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai

03/24/2025 | DuPont
DuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.

Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

03/24/2025 | Zuken
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.

Just Because You Can, Doesn’t Mean You Should

03/20/2025 | Tony Plemel, Flexible Circuit Technologies
Decisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.

Calling All Designers: The Latest Design Technology and AI  

03/20/2025 | Andy Shaughnessy, Design007 Magazine
Advanced design technology and AI were in the spotlight at the annual Design Town Hall, held March 19 during IPC APEX EXPO 2025. Speakers included IPC’s Peter Tranitz, Matt Kelly, Devan Iyer, as well as a panel on the use of AI in PCB design moderated by Susan Kayesar of Siemens.
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