Fresh PCB Concepts: Traceability in PCB Design
The Shaughnessy Report: Back to the Future
Designers Notebook: Addressing Future Challenges for Designers
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
October 1, 2024 | U.S. Department of DefenseEstimated reading time: 1 minute
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
"The DoD requires state-of-the-art advanced printed circuit board manufacturing capability to support defense programs," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy (ASD(IBP)). "This project provides domestic manufacturing capabilities to meet demand for current and future U.S. systems."
"This $30 million investment will help enable TTM to build a new 200,000+ square foot facility, significantly increasing domestic production of ultra-high density printed circuit boards and bolstering supply chain resilience in line with the 2024 National Defense Industrial Strategy," added Mr. Anthony Di Stasio, Director of the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate within OASD(IBP).
This was the 70th award the DPAP program issued across multiple areas in Fiscal Year 2024, for a total value of $672 million. The DPAP office is overseen by the MCEIP directorate.
Share on:
Suggested Items
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
02/21/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
BAE Systems Secures $251M Contract to Support U.S. Navy’s AEGIS Combat System
02/18/2025 | BAE SystemsIn November 2024, the U.S. Navy awarded BAE Systems a five-year, $251 million contract to provide the AEGIS Technical Representative (AEGIS TECHREP) organization with critical large-scale system engineering and on-site technical expertise for the complex combat system configurations for the U.S. Navy, the Missile Defense Agency, and the Foreign Military Sales program.
RTX's Raytheon Completes 10 Subsystem Demonstrations for U.S. Army's Next-Generation Short-Range Interceptor Program
02/18/2025 | RTXRaytheon, an RTX business, announced a series of 10 successful subsystem demonstrations for the U.S. Army's Next-Generation Short-Range Interceptor (NGSRI), which will eventually replace the Stinger® surface-to-air missile.
Teledyne FLIR’s Black Hornet 4 Nano-Drone Selected as Winner of the Defense Innovation Unit’s Blue UAS Challenge
02/18/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated (NYSE:TDY), announced that its Black Hornet® 4 Personal Reconnaissance System has been selected as a winner of the Blue UAS Refresh.
Northrop Grumman Secures $1.4 Billion in Contracts to Modernize Global Air and Missile Defense
02/17/2025 | Northrop GrummanNorthrop Grumman Corporation secures two significant contracts totaling $1.4 billion to advance air and missile defense capabilities for the U.S. Army and Poland.