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IPC Releases Newest List of Standards Updates, Revisions
June 3, 2024 | IPCEstimated reading time: Less than a minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2.
IPC-7711/21D
Rework, Modification and Repair of Electronic Assemblies
IPC-7711/21D provides guidance on procedures for rework, repair, and modification of printed board and cable or wire harness assemblies. IPC-7711/21D provides the requirements, tools, and materials to be used in the rework, repair, and modification of electronic products and for cable or wire harness assemblies.
IPC-2221C
Generic Standard on Printed Board Design
IPC-2221C establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with organic materials; the interconnections may be single, double, or multilayered.
To find out the rest of the newest standards, which were published in the Spring 2024 issue of IPC Community, click here.
Suggested Items
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Despite Regional 200x Funding Differences, Post-Quantum Readiness Won’t Hinder eIDAS Unity
11/05/2024 | ABI ResearchPost-Quantum Cryptography (PQC) inevitably has an outsized impact on a technology remit covering many trust service use cases, with cryptographically robust signing acting as the market's core. Without this, there is no trust and, therefore, no Electronic Identification and Trust Services (eIDAS).
The ICAPE Group Announces the Launch of Its E-Shop at Electronica
10/31/2024 | BUSINESS WIREThe ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.
2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
10/24/2024 | IPCThe 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.