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EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection

02/20/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.

Arteris Revolutionizes Semiconductor Design with FlexGen

02/19/2025 | Globe Newswire
Arteris, Inc., a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP.

Würth Elektronik: PCB Threaded Connections Using Press-fit Technology

02/18/2025 | Würth Elektronik
Würth Elektronik, manufacturer of electronic and electromechanical components for the electronics industry, presents its “REDCUBE PRESS-FIT for Automotive”, a new range of threaded connections specially optimized for the automotive industry.

Qorix, Qualcomm Cooperate to Drive the Future of Software-Defined Vehicles

02/07/2025 | Qualcomm Technologies, Inc.
Qorix, a global provider of modular and integrated automotive middleware solutions, and Qualcomm Technologies, Inc., a leader in automotive platforms, announced a technology cooperation to help drive the future of software-defined vehicles (SDVs) with high performance, pre-integrated and scalable solutions designed to enable OEMs and tier-1 suppliers to develop next generation vehicles quickly and efficiently.

A3 Reports North American Robotics Market Holds Steady in 2024 Amid Sectoral Variability

02/05/2025 | BUSINESS WIRE
The North American robotics market demonstrated minor overall growth in 2024, reflecting resilience and adaptability as automation strengthened its role across industries.
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