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epoxySet Unveils UC-2210M - Urethane for Electronic Component Protection
April 29, 2024 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
This room temperature curing system is easy to apply as a potting, encapsulation or casting compound. The low viscosity allows for easy air removal as well as penetration of intricate encapsulated areas.
UC-2210M cures to a semi-rigid polymer that minimizes stresses on delicate and sensitive components. It has good thermally conductive thus further protecting electronics from heat stresses. Offering exceptional thermal shock from -55 to 130 °C, it also provides high impact resistance.
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Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
03/27/2025 | Jerome Larez -- Column: Global PCB ConnectionsAs a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.