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Rehm Presents Sustainable Solution for Cost-effective Vapor Phase Soldering
February 6, 2024 | Rehm Thermal SystemsEstimated reading time: 1 minute
Closed-loop principle and active Galden filtration for sustainable condensation soldering by Rehm Thermal Systems at AMPER in Brno from March 19-21, 2024, at booth F.332.
AMPER in Brno, Czech Republic, has become one of the most important trade events for the electronics industry in Europe. With over 400 exhibitors from the fields of electrical engineering, energy, automation, communication, lighting, it offers insights into the latest trends and innovations for over 25,000 professionals from various industries.
Rehm Thermal Systems is exhibiting again this year and presents from March 19th to 21st, 2024, in Hall F, Booth 332, a CondensoXC Vac for condensation soldering. The Condenso series offers much greater flexibility for the condensation soldering process than is achievable with conventional soldering methods.
Patented injection principle for optimal profiling
The use of the injection principle and control of temperature and pressure enable more precise and diverse reflow profiling. Thus, reproducible soldering conditions are guaranteed, increasing process stability. For optimal and nearly void-free results, a vacuum option is available for all Condenso systems.
Integrated closed-loop system for minimal medium consumption
With the integrated closed-loop system for the injected medium Galden®, Rehm has implemented a future-proof, sustainable solution from the outset. The principle is equally efficient and resource-saving. After soldering, the vacuum and/or cooling process starts. At the same time, the process gas is extracted and cleaned. During extraction, a vacuum is created, which also ensures rapid drying of the soldered goods and the process chamber, thus minimizing losses when ejecting the products.
The extracted Galden® is filtered and cleaned of impurities using granules. This allows approximately 99.9% of the medium to be recovered. The cleaned liquid is stored in a container at room temperature and made available for further processes. This eliminates evaporation losses and energy losses. The hermetic sealing of the process chamber (simultaneously vacuum chamber) also excludes the "evaporation loss" of Galden® during soldering. In addition to minimal maintenance effort, operating costs are reduced due to lower medium consumption.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.