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Winners of 2025 IPC Masters Competition China Announced

04/02/2025 | IPC
On March 26-28, the IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition brought nearly 500 electronics industry elites from 18 provinces and municipalities.

Vertical Aerospace Adopts Universal Fast-Charging Standard to Accelerate eVTOL Deployment

04/01/2025 | BUSINESS WIRE
Vertical Aerospace (Vertical), a global aerospace and technology company that is pioneering electric aviation, announces it will adopt the Combined Charging Standard (CCS) for the VX4, joining BETA Technologies and Archer Aviation in driving a universal, fast-charging system for electric vertical take-off and landing (eVTOL) aircraft.

Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors

03/28/2025 | ROHM
Mazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.

Life in the Fast Lane: A Smooth Ride for Bill Cardoso's New Business Converting Cobra Roadsters to Electric

03/26/2025 | Barry Matties, IPC Community
Bill Cardoso has established quite a list of accomplishments behind his name, from nuclear scientist, organic farmer, and IPC member to entrepreneur and owner of the largest U.S.-based manufacturer in the field of X-ray inspection. Three years ago, though, he brought home a Cobra roadster, and his son’s visceral reaction led to yet another new business venture.

Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025

03/13/2025 | Aismalibar
Aismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
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