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KLA Names Michael R. McMullen to Board of Directors
July 25, 2023 | KLAEstimated reading time: Less than a minute

KLA Corporation announced the appointment of Michael R. McMullen to its Board of Directors and Compensation and Talent Committee.
McMullen was named President of Agilent Technologies in 2014 and Chief Executive Officer in 2015 and has been with the company and its predecessor, Hewlett-Packard, for more than 30 years.
"We are excited to welcome Mike McMullen to the KLA board," commented Robert M. Calderoni, chair of the board of KLA. "Mike's extensive experience in driving growth at a global scale in complex multinational equipment businesses makes him an ideal fit for KLA's board as we execute our long-term growth strategies."
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Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.