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Solving the Toughest BGA Challenges in Electronics
July 30, 2025 | Nash Bell, BEST Inc.Estimated reading time: Less than a minute
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Integrating standard BGAs and their stacked counterpart, package-on-package (PoP), can further increase density, facilitating greater design flexibility for compact and efficient circuit designs in applications ranging from consumer electronics to automotive systems and medical devices. Despite these advantages, the complexity of BGA packages introduces challenges during rework, requiring innovative methods and thorough inspection practices to maintain performance and reliability.
BGA rework involves removing and replacing BGA packages on printed circuit boards because of defects, upgrades, and/or failures (Figure 1). This process is vital for ensuring the integrity and functionality of electronic devices. Engineers employ several techniques, each offering distinct advantages and requiring careful consideration based on specific applications.
To continue reading this article, which originally appeared in the July 2025 edition of SMT007 Magazine, click here.
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