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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Setting Design Constraints Effectively
July 31, 2025 | Stephen V. Chavez, Siemens EDAEstimated reading time: 1 minute
PCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
At times, especially with very complex designs, it’s no easy task to make sense of these rules while creating and implementing these design constraints. It can be daunting and time-consuming. How many times during the initial phase of the design process have we heard project management ask, “What is taking so long? Why haven’t you started placing components and routing? Why do you even need constraints?”
I’m sure many can relate to such questions. The goal for any PCB design is to be “correct by construction,” where you have the highest potential for first-pass success. This means that revision 1 works with no respins required, and there are no interruptions in the process of getting the product to market as fast as possible. This is accomplished by implementing and utilizing design constraints along with industry best practices, which are vital toward achieving PCB design success.
Design constraints are typically derived from customer requirements. Depending on the intended function of the end product, how it needs to function and under what conditions it needs to operate are the keys to deriving the specific details of the actual constraints to be implemented in your design. Make sure you work closely with your manufacturers (both fabrication and assembly) from the very beginning of the project and throughout the design process. I cannot stress enough that close collaboration with your manufacturers, also known as your external stakeholders, is key to downstream success.
To continue reading this article, which originally appeared in the July 2025 issue of Design007 Magazine, click here.
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Design for Test: A New Book from The Test Connection, Inc.
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Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.