-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
GPV’s Site Engagement Meeting for the Eastern, Central European Sites
June 9, 2023 | GPVEstimated reading time: Less than a minute

This week, local management teams from the Eastern and Central European operating business units in GPV met with the Executive Leadership Team (ELT). The meetings took place in Slovakia. On Monday, ELT met with the cable sites from Slovakia and Austria. Tuesday and Wednesday, the electronics sites from Estonia, Slovakia and Switzerland were gathered.
“This week, we had the third cluster of engagement meeting with operating business units, where we meet with the local management teams. Apart from discussing professional subjects like performance and must wins for the coming period, we focus on socialising to build on the personal relations and increase our understanding of our new “One Company”. The purpose of our engagement meetings is to discuss the next four quarters and engage with each other on this. An important outset for such dialogues is to learn and understand what each OBU is especially proud of. We also discussed how to bring down our high inventory level,” says Bo Lybaek, CEO at GPV.
Next week, the Executive Leadership Team will visit GPV Electronics Mexico for the last Site Engagement Meeting before the European summer vacation period.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Rogers Reports Q1 2025 Results
04/30/2025 | Rogers CorporationNet sales of $190.5 million decreased 0.9% versus the prior quarter. Advanced Electronics Solutions (AES) net sales increased by 1.8% primarily related to higher ADAS and aerospace and defense sales, partially offset by lower EV/HEV and industrial sales. Elastomeric Material Solutions (EMS) net sales decreased by 4.3% primarily from a seasonal decline in portable electronics sales and lower EV/HEV sales, partially offset by higher general industrial sales.
Kasuo Electronics Launches Advanced Testing Laboratory to Strengthen Global Supply Chain Quality Assurance
04/29/2025 | BUSINESS WIREKasuo Electronics Co., Ltd, a globally recognized trader of electronic components, has officially operationalized its state-of-the-art testing laboratory.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.