Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
ACCM Joins Polar’s Speedstack Material Partner Program
June 10, 2025 | Polar InstrumentsEstimated reading time: Less than a minute
Advance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
“Availability of Celeritas in Speedstack eases the specification of ACCM materials for the OEM design community. PCB Technologists often mandate specific materials for demanding high-speed and high-density applications,” said Michael Gay, VP of marketing at ACCM.
This partnership:
- Allows simplified production of build-up technologies with Celeritas
- Provides an on-line and on premise material library from ACCM in Speedstack
- Opens new opportunities to extend the use of UHDI
Speedstack is in widespread use with OEMs who specify PCB stackups for specific applications, and eases the communication of stackup information throughout the PCB supply chain as PCB fabricators across the world are familiar with Speedstack’s clear and concise documentation and the availability of stackup data in XML format which can be imported into multiple production systems at the time of fabrication.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
PCBAA Names Industry Veteran Dan Weber to Board of Directors
10/31/2025 | PCBAAThe Printed Circuit Board Association of America has added Dan Weber, Executive Vice President and General Counsel at TTM Technologies, to the PCBAA board of directors.
UAE Automotive PCB Research Report 2025: A $971.16 Million Market by 2030
10/31/2025 | Globe NewswireThe UAE Automotive PCB Market was valued at USD 654.07 Million in 2024, and is projected to reach USD 971.16 Million by 2030, rising at a CAGR of 6.80%.
KLA Reports Fiscal Q1 2026 Results
10/31/2025 | PRNewswireKLA Corporation announced financial and operating results for its first quarter of fiscal year 2026, which ended on Sept. 30, 2025, and reported GAAP net income of $1.12 billion and GAAP net income per diluted share of $8.47 on revenues of $3.21 billion.