-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Cadence AI Autorouter May Transform the Landscape
June 19, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

Patrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?
Andy Shaughnessy: Cadence has been updating and adding functionality to autorouters. What does Cadence offer regarding autorouting technology, and how does it help designers tackle complex and high-speed challenges?
Patrick Davis: While autorouting is a critical phase of the PCB design process, Cadence’s focus expands beyond routing to include the acceleration of adjacent functions that have a direct impact on quality of route. These include placement and power/ground distribution. By focusing on this broader challenge, it opens a broader solution set, allowing designers to converge on an optimized solution more quickly.
Our bleeding-edge customers, who design the most complex boards, spend as much time in placement as they do in routing. They know poor placement will inevitably result in additional layers, poor routing, and inefficient resource use. This is why our next-generation automation solution focused initially on placement. Feedback from our customers has been outstanding, confirming the critical role that excellent placement plays in simplifying subsequent routing tasks.
Once placement is completed, power plane definition is the next time sink, and is ripe for automation. Our tool also excels at power plane placement, allowing power to be efficiently managed alongside component placement, mirroring real-world designer workflows.
Finally, we reach routing, but with optimized placement and plane shapes, full board routing becomes viable. Our router, initially introduced in the IC packaging space, is now routing boards. We are seeing good results on designs of average complexity, with our current focus on addressing highly constrained, extremely dense boards.
Shaughnessy: Your autorouter announcement offered a roadmap for AI integration into your routers. What is the update on this integration and Cadence’s overall AI strategy?
To read the entire interview, which originally appeared in the June 2025 issue of Design007 Magazine, click here.
Suggested Items
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.
ASMPT Demonstrates Technology Leadership in SMT Assembly
04/09/2025 | ASMPTThe rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.
Incap US Invests in Advanced SMT Technology
04/09/2025 | IncapIncap US invested approximately USD 2 million (EUR 1.82 million) in advanced SMT (surface-mount technology) production equipment to expand its production capacity.
Yamaha Reveals Latest Updates Boosting Ease of Use in 1 STOP SMART SOLUTION
04/01/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has announced automated programming capabilities in YSUP factory software that streamline program generation for all surface-mount processes, including dispensing, printing, placement, and inspection.
ASMPT: New Stationary Camera for SIPLACE Placement Machines
03/13/2025 | ASMPTMarket and technology leader ASMPT is offering a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN. It delivers significantly faster processing speeds as well as more component flexibility – from highly integrated ball grid arrays (BGAs) to large-format odd shape components (OSCs).