-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Teledyne’s New High-resolution Multispectral Line Scan Camera Extends Defect Detection Beyond the Surface
April 5, 2022 | Globe NewswireEstimated reading time: 1 minute
Teledyne DALSA, a Teledyne Technologies company, is pleased to announce the release of its multispectral Camera Link HS (CLHS) line scan camera—a new model of the award-winning Linea product line. This latest high resolution line scan camera provides spectrally independent RGB and NIR outputs making it uniquely capable of handling some of the most challenging inspection applications by detecting defects both on and under the surface of a wide variety of materials, components, and products.
“The Linea ML 8k multispectral camera offers versatile capabilities to meet the increasingly demanding requirements of a number of today’s challenging inspection applications, like banknotes, passports, and other high security print,” said Xing-Fei He, Senior Product Manager at Teledyne DALSA. “In addition, we have been able to deliver spectrally independent outputs of the RGB and NIR channels which enables accurate defect detection both on and under the surface of products like semiconductor wafers and printed circuit boards (PCBs) in a single scan, greatly simplifying vision system designs.”
The Linea ML 8k multispectral camera uses Teledyne DALSA’s latest CMOS 8k quad linear sensor with a 5x5 ?m pixel size and delivers a maximum line rate of 70 kHz x 4 using CLHS fibreoptic interface. The camera also has built-in SFP+ transceivers that convert electrical signals to optical signals and connects directly to fibreoptic cables using LC connectors. Combined with the Teledyne DALSA Xtium™2 CLHS series of high-performance frame grabbers, the Linea ML 8k multispectral camera, like all of the Linea ML cameras, represent a breakthrough in data throughput in the industry.
Key Features:
- Teledyne DALSA’s newest CMOS quadlinear sensor
- Spectrally independent RGB and NIR outputs for accurate detection of defects without spectral interference
- Independent exposure control for each channel for better white balancing
- Works seamlessly from max speed to stop conditions
- Next generation Camera Link HS interface with field-proven data reliability
- Direct connection to fibreoptic cables for extended cable lengths up to 300 meters
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Partnerships Drive Innovation for a Brighter Manufacturing Future
08/26/2025 | Barry Matties, I-Connect007When Schweitzer Engineering Laboratories (SEL) opened its greenfield facility in 2023, it did so with careful attention to choosing its suppliers. In this discussion, Collin Peters, electronics business director for North America at MKS’ Atotech, and Justin Kennedy, manager of engineering at SEL, explore their unique partnership that includes collaborative efforts to develop innovative solutions like the Uniplate® PLBCu6 line.
Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar InstrumentsTransmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.
Boeing, Angolan Ministry of Transport Sign Memorandum of Strategic Cooperation
06/21/2025 | BoeingBoeing and the Ministry of Transport of the Republic of Angola signed a Memorandum of Strategic Cooperation to explore initiatives aimed at advancing the Angolan aviation sector, in partnership with TAAG Angola Airlines.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.