Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
The Shaughnessy Report: Solving the Data Package Puzzle
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Teledyne’s New High-resolution Multispectral Line Scan Camera Extends Defect Detection Beyond the Surface
April 5, 2022 | Globe NewswireEstimated reading time: 1 minute
Teledyne DALSA, a Teledyne Technologies company, is pleased to announce the release of its multispectral Camera Link HS (CLHS) line scan camera—a new model of the award-winning Linea product line. This latest high resolution line scan camera provides spectrally independent RGB and NIR outputs making it uniquely capable of handling some of the most challenging inspection applications by detecting defects both on and under the surface of a wide variety of materials, components, and products.
“The Linea ML 8k multispectral camera offers versatile capabilities to meet the increasingly demanding requirements of a number of today’s challenging inspection applications, like banknotes, passports, and other high security print,” said Xing-Fei He, Senior Product Manager at Teledyne DALSA. “In addition, we have been able to deliver spectrally independent outputs of the RGB and NIR channels which enables accurate defect detection both on and under the surface of products like semiconductor wafers and printed circuit boards (PCBs) in a single scan, greatly simplifying vision system designs.”
The Linea ML 8k multispectral camera uses Teledyne DALSA’s latest CMOS 8k quad linear sensor with a 5x5 ?m pixel size and delivers a maximum line rate of 70 kHz x 4 using CLHS fibreoptic interface. The camera also has built-in SFP+ transceivers that convert electrical signals to optical signals and connects directly to fibreoptic cables using LC connectors. Combined with the Teledyne DALSA Xtium™2 CLHS series of high-performance frame grabbers, the Linea ML 8k multispectral camera, like all of the Linea ML cameras, represent a breakthrough in data throughput in the industry.
Key Features:
- Teledyne DALSA’s newest CMOS quadlinear sensor
- Spectrally independent RGB and NIR outputs for accurate detection of defects without spectral interference
- Independent exposure control for each channel for better white balancing
- Works seamlessly from max speed to stop conditions
- Next generation Camera Link HS interface with field-proven data reliability
- Direct connection to fibreoptic cables for extended cable lengths up to 300 meters
Share on:
Suggested Items
DuPont to Showcase Advanced Semiconductor Wet Etching Innovations at the Surface Preparation and Cleaning Conference
05/13/2025 | DuPontDuPont announced that it will present its latest developments in semiconductor wet etching technologies at the upcoming Surface Preparation and Cleaning Conference (SPCC) in Chandler, Arizona, beginning May 20.
Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum
05/12/2025 | TrendForceTrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024.
AEye, LITEON Confirm Production of First Apollo Units from New Manufacturing Line
05/12/2025 | BUSINESS WIREAEye, Inc., a global leader in adaptive, high-performance lidar solutions, announced it has successfully produced the first Apollo lidar sensors from the LITEON manufacturing line in Taipei, Taiwan.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Manncorp Launches Industry-First 'Build Your Own SMT Line' Tool
05/02/2025 | ManncorpManncorp, a leading supplier of SMT (Surface Mount Technology) equipment, proudly announces the official launch of its “Build Your Own SMT Line” tool – a first-of-its-kind resource in the electronics manufacturing industry. Introduced just one month ago, this revolutionary online feature gives manufacturers the unprecedented ability to design a complete SMT production line tailored to their exact needs – all from their desktop.