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DuPont Announces Additional Leaders and Company Name for the Intended Spin-Off of the Electronics Business

04/29/2025 | PRNewswire
DuPont announced Qnity Electronics, Inc. as the name of the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business.

New RF Materials Offer Options for RF Designers

04/29/2025 | Andy Shaughnessy, Design007 Magazine
The RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.

Choosing the Right Strategic Path

04/29/2025 | Marcy LaRont, PCB007 Magazine
Tom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.

OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.

North American PCB Industry Shipments Down 3.1% in March

04/28/2025 | IPC
IPC announced the March 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.
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