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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Improving Li-Ion Batteries by Coating Their Cathode
March 12, 2019 | Tokyo TechEstimated reading time: 3 minutes
Figure 2. Effect of the BaTiO3 nanodots
The BaTiO3 nanodots concentrate electric current in a ring around them and create paths through which Li ions can pass, even at really high charge/discharge rates.
Page 2 of 2Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation today announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Wire Harness Taking a Step in the Right Direction
04/08/2026 | Nolan Johnson, SMT007 MagazineTo fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.
Lockheed Martin Ships 2nd Aegis Vessel Set with AN/SPY-7 Radar to Japan
03/16/2026 | Lockheed MartinLockheed Martin, successfully delivered the second Aegis System Equipped Vessel (ASEV) shipset of AN/SPY-7(V)1 radar equipment to the Japan Ministry of Defense (JMOD).
Marcy’s Musings: Our Own March Madness
03/18/2026 | Marcy LaRont -- Column: Marcy's MusingsI spend a lot of time looking ahead, whether that's toward future technology, market needs, or even the future of my editorial calendar. The industry is looking ahead as well. Every year at APEX EXPO, for example, participants get a clearer look at where we’re headed over the next three to five years. In fact, as our March issue is published, we will be in the throes of another great show (our own version of March Madness).