Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Würth Elektronik ICS at PCIM Europe 2025

04/14/2025 | Wurth Elektronik
Würth Elektronik ICS will be exhibiting at PCIM in Nuremberg from 6 to 8 May 2025. The specialist for PCB connection solutions in the high-current sector and inventor of Powerelements will be focussing on power electronics at exhibition stand 337 in hall A6.

EDA Tools and RF Design Techniques

04/14/2025 | Andy Shaughnessy, Design007 Magazine
High-speed PCB design is complex enough, but RF design can be a whole new ball game. RF designers have to contend with tuning and other ideas that traditional PCB designers don’t have to worry about, as well as crosstalk, parasitic capacitance, and material limitations. Most PCB design tool companies now offer RF design options, so designers no longer have to use pureplay RF design tools for anything but the most cutting-edge designs. Cadence Design Systems expanded its RF EDA offerings by acquiring the RF software company AWR a few years ago. We asked David Vye, product management director at Cadence, to share his thoughts on EDA software, RF design, and what new RF designers and engineers need to understand.

Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers

04/11/2025 | Avnet
Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.

The Key to First-pass Success in PCB Design

04/10/2025 | Gerry Partida, Summit Interconnect
In the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.

Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future

04/09/2025 | Real Time with...IPC APEX EXPO
Peter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in