Shane Whiteside, PCBAA
This column will cover the support and growth of U.S. domestic printed circuit board (PCB) manufacturers and suppliers as they contribute to national security.
Latest Column: American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: AI-driven Inverse Stackup Optimization
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: ‘Innovation X: Why a Company’s Toughest Problems Are Its Greatest Advantage’
Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Prashant Patel, Alpha Circuit
From bold predictions about the role of AI and robotics in PCB manufacturing to insights on the evolving demands of advanced electronics, this column promises to be a thought-provoking guide for professionals eager to stay ahead of the curve.
Latest Column: Facing the Future: Charting the Path Forward for the American PCB Industry
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: Another PCB Design Paradigm Shift in the Works
IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Awarding Scholarships and Awards in 2023
Bob Duke, American Standard Circuits
Bob offers advice on the most important aspects of global sourcing.
Latest Column: Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
Happy Holden, I-Connect007
Happy will endeavor to catch our readers up on the latest technologies developed around the world since Karl Dietz retired this column in 2016.
Latest Column: Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: It’s Only Common Sense It’s Not the Market’s Fault—Take Responsibility for Your Business
Marcy LaRont, I-Connect007
Marcy is dedicated to making PCB007 the top online source of news and information for all things related to printed circuit boards.
Latest Column: Marcy’s Musings: Boosting Your Inner Layer Precision and Production Outcomes
Dr. Preeya Kuray, Materials Scientist
This column discusses the impact of global affairs on PCB R&D in America, as well as the growing intersection between the PCB and chip packaging industries.
Latest Column: Material Insight: David Griesel: Career Success Requires Tenacity, Flexibility
Nolan Johnson, I-Connect007
Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing.
Latest Column: Nolan’s Notes: Emerging Trends in 2025
John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Mastering Technology Prognostication
Tom Kastner, GP Ventures, Ltd.
'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.
Latest Column: Punching Out: New Year’s Goals for Selling a Business
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: The Shift From China to Southeast Asia
Don Ball, Chemcut
Discussions about topics concerning wet processes, wet processing equipment, and how changes in these areas can improve the PCB industry.
Latest Column: The Chemical Connection: Can Changing Spray Nozzles Improve My Etch Quality?
Chris Mitchell, IPC, Global Government Affairs
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: How IPC Drove Industry Progress Through Public Policy Advocacy in 2024
Brittany Martin, I-Connect007
Lighting up the industry with marketing ideas that connect, engage, and inspire.
Latest Column: The Marketing Minute: Building Connections in the Electronics Industry
Hannah Grace & Paige Fiet, IPC Emerging Engineers
Two up and coming engineers discuss the bridge between electronics education and the electronics industry.
Latest Column: The New Chapter: The Benefits of Continuing Education
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Commonsense Cost Cutting
Steve Williams, The Right Approach Consulting
A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.
Latest Column: The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: The Designer of Tomorrow
Michael Carano, IPC
A comprehensive look at plating, metallization processes and PWB fabrication techniques.
Latest Column: Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation