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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Shane Whiteside, PCBAA
This column will cover the support and growth of U.S. domestic printed circuit board (PCB) manufacturers and suppliers as they contribute to national security.
Latest Column: American Made Advocacy: American Microelectronics Power the Future of High Technology
Chandra Gupta, Remtec Inc.
Cutting through buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
Latest Column: Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: ReRAM–The Industry's Next Game-Changer
Jesse Vaughan, Summit Interconnect
A column about market/industry trends, workforce engagement, processes/technology roadmaps.
Latest Column: Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Dana Korf, Victory Giant Technology and Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’
Dennis Fritz, Fritz Consulting
Dennis covers military and defense industry topics and applications.
Latest Column: Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3
Team Schmoll America, Schmoll America
An exploration into the key technical challenges in mechanical and optical processes shaping the industry today, while looking into the future at the same time.
Latest Column: Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production
Prashant Patel, Alpha Circuit
From bold predictions about the role of AI and robotics in PCB manufacturing to insights on the evolving demands of advanced electronics, this column promises to be a thought-provoking guide for professionals eager to stay ahead of the curve.
Latest Column: Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global Electronics Association Education Foundation, Global Electronics Association
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Awarding Scholarships and Awards in 2023
Bob Duke, American Standard Circuits
Bob offers advice on the most important aspects of global sourcing.
Latest Column: Global Sourcing Spotlight: The True Cost of Low Cost
Happy Holden, I-Connect007
Happy will endeavor to catch our readers up on the latest technologies developed around the world since Karl Dietz retired this column in 2016.
Latest Column: Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: It’s Only Common Sense: Hire for Hunger, Train for Skill
Marcy LaRont, I-Connect007
Marcy is dedicated to making PCB007 the top online source of news and information for all things related to printed circuit boards.
Latest Column: Marcy’s Musings: Operating Without a Rulebook
Dr. Preeya Kuray, Materials Scientist
This column discusses the impact of global affairs on PCB R&D in America, as well as the growing intersection between the PCB and chip packaging industries.
Latest Column: Material Insight: David Griesel: Career Success Requires Tenacity, Flexibility
Nolan Johnson, I-Connect007
Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing.
Latest Column: Nolan’s Notes: Wire Harness—The Underdog of the Industry
John Mitchell, Global Electronics Association
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Attending APEX EXPO 2026 Critical for Electronics Manufacturing Leaders
Brian Buyea, Remtec Inc.
Brian explores the technologies in material science that make high-power electronics possible.
Latest Column: Powering the Future: Why Thermal Management Defines the Future of Electronics
Tom Kastner, GP Ventures, Ltd.
'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.
Latest Column: Punching Out: How Many PCB Companies Are There in North America Now?
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: Our Big ‘Why’ in the Age of AI
Don Ball, Chemcut
Discussions about topics concerning wet processes, wet processing equipment, and how changes in these areas can improve the PCB industry.
Latest Column: The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit
Chris Mitchell, Global Electronics Association
In this column, Global Electronics Association VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
Brittany Martin, I-Connect007
Lighting up the industry with marketing ideas that connect, engage, and inspire.
Latest Column: The Marketing Minute: Your Metrics Aren’t Telling the Full Story
Hannah Grace & Paige Fiet, IPC Emerging Engineers
Two up and coming engineers discuss the bridge between electronics education and the electronics industry.
Latest Column: The New Chapter: The Benefits of Continuing Education
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Ultra-high Stakes—Will UHDI Enter the Mainstream for Low- and Mid-volume?
Steve Williams, The Right Approach Consulting
A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.
Latest Column: The Right Approach: Reflections on 50 Years in the Business, Part 3
Michael Carano, Global Electronics Association
A comprehensive look at plating, metallization processes and PWB fabrication techniques.
Latest Column: Trouble in Your Tank: Understanding Interconnect Defects, Part 2