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Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Material Insight
Column from: Dr. Preeya Kuray
Preeya Kuray is a material scientist. She received her PhD in materials science engineering in 2020 from Penn State, where she authored several peer reviewed publications on polymer dynamics and served as vice president of the Materials Research Society student chapter. She currently works on developing low-loss buildup materials at AGC. She looks forward to sharing insights from PCB veterans while incorporating pieces of her perspective as a material scientist PhD and newcomer to the PCB field.