The Chemical Connection: More Solutions to Common PCB Etching Questions
It’s Only Common Sense: How to Demonstrate Grace Under Pressure During Tough Times
FTG Named to the TSX30
Firan Technology Group, a leading provider of aerospace and defence electronic products and subsystems, announced that it has been named to the 2026 TSX30®, Toronto Stock Exchange's annual ranking of the top-performing...
RapidDirect Launches PCB Division to Integrate PCB and Mechanical Manufacturing
RapidDirect, a leading global provider of custom on-demand digital manufacturing, announced the official launch of its new Printed Circuit Board...
AI Drives High-End IC Substrate Growth to US$19.51B in 2026
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate...
Remtec Partners With Edge4Vets to Create Career Pathways for Military Veterans in High-Tech Manufacturing
Veteran intern Gary Colas represents the first step in Remtec’s commitment to recruiting, developing, and hiring more...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 11, 2026 | Marcy LaRont, I-Connect007
I feel compelled to start off by recognizing that today marks the 25th anniversary of the tragic activities that took place on 9/11/2001. Like so many of us, I will never forget exactly where I was and what I was doing when I heard that United flights 11 and 175 had struck the World Trade Center in NYC. That day, the world was forever changed, and the effects still reverberate. Today, I am taking a moment to remember the lives lost and the heroism and coming together that day brought about.
Evaluating Physical Process Parameters to Improve Copper Plating Distribution
September 11, 2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.
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Trouble in Your Tank: Pre-electroless Causes of Voids
September 2, 2026 | Michael Carano, Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it...
Marcy’s Musings: The Power of the Electronics Ecosystem
August 19, 2026 | Marcy LaRont, Marcy's Musings
Electronics hardware product design and manufacturing is a completely interconnected (pun intended) and interdependent system. Success depends on every part of the ecosystem functioning together, a reality that once seemed easy to...
The Marketing Minute: Why I Wrote 'Marketing in 17 Minutes'
August 12, 2026 | Brittany Martin, The Marketing Minute
This month, I'm excited to release my first book, "Marketing in 17 Minutes: A Guide to Marketing in the Electronics Industry." After writing 17 (and more) Marketing Minute columns and working with electronics companies, I realized I...
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