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The Human Side of Automation
The September issue examines why human experience remains essential as PCB manufacturers adopt AI and automation, then looks at how Europe’s design communities use regional perspectives on today’s global industry challenges.
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This issue examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products.
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FTG Reports 34% Revenue Growth, 75% Booking Increase in Q3 2026
In Q3 2026, the Corporation realized significant value from its ongoing strategic initiatives. FTG is investing its capital in ways that will drive...
United Electronics Corporation Installs New Automated Pumice Surface Preparation Line
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask...
Breaking News: I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part podcast series. In this episode,...
ICAPE Announces the Initiation of Coverage of Its Stock by Euroland
The ICAPE Group, a global technology distributor of printed circuit boards (PCBs) and custom electronic parts, announces the initiation of coverage...
Aismalibar to Showcase Advanced Thermal Management Materials at The Battery Show North America 2026
Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show...
SCHMID Pushes Toward the Submicron
October 7, 2026 | Marcy LaRont, I-Connect007 Magazine
Fabricators are confronting process requirements today that would have seemed foreign to the PCB shop not long ago, presenting both a promise and a significant manufacturing challenge. SCHMID is one company rising to it in big ways. SCHMID's Laurent Nicolet, VP for the Business Unit PCB, talks about the convergence between PCB fabrication and semiconductor processing as feature sizes shrink, the emergence of glass as an attractive substrate and interposer material, and SCHMID’S embedded trace technology and the work toward moving that technology into high-volume manufacturing.
MORE ARTICLES
Marcy’s Musings: A World of Difference
September 17, 2026 | Marcy LaRont, Marcy's Musings
I've spent a good deal of time in Asia over the years, both traveling and living there, so arriving in Thailand for THECA wasn't my first experience stepping into another culture or another way of doing business. Still, there is...
The Marketing Minute: When Everyone Is a Thought Leader, No One Is
September 8, 2026 | Brittany Martin, The Marketing Minute
There is no shortage of expertise in the electronics industry. If you spend just a few minutes talking with someone who has been designing circuit boards, running a manufacturing facility, or troubleshooting assembly lines for 20 or...
The Chemical Connection: More Solutions to Common PCB Etching Questions
September 9, 2026 | Don Ball, The Chemical Connection
Rather than pontificating at great length on a subject I know nothing about, although I have been known to do this on occasion (the scientific term for this is “baffling them with bull****”), I decided to comment on some basic...
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- Building Community, Sharing Knowledge for Designers in Italy with Pietro Vergine
- The Rise and Fall of Europe's PCB Community by John Watson