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This issue examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products.
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Qnity Advances Node Materials Innovation with KLA Inspection Technology
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP...
Eltek Reports Q2 2026 Results
Eltek Ltd., a leading global manufacturer of high-quality printed circuit boards, announced its financial results for the quarter ended June 30,...
MKS Earns Zhen Ding 2026 Awards for Service and Innovation
MKS Inc., a global provider of technologies that transform our world, announced it has received two distinguished contribution awards for 2026 from...
Charles Wert Named President of ASC Sunstone Circuits
Anaya Vardya, CEO of American Standard Circuits and ASC Sunstone Circuits, has announced the appointment of Charles Wert as President of ASC Sunstone...
Zhen Ding, NTHU Showcase Smart Manufacturing R&D at IEEE Conference
Zhen Ding Technology Holding Limited, a global PCB industry leader, and National Tsing Hua University (NTHU) have achieved significant results...
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The Relevance of VeCS as an HDI Process Option
August 20, 2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.
Dan’s Biz Bookshelf: Revisiting 'The Popcorn Report'
August 20, 2026 | Dan Beaulieu, Dan's Biz Bookshelf
One of the things I enjoy most about reading is occasionally rereading books that made a big impression years ago. Sometimes they hold up beautifully, sometimes they don't, and sometimes they become even more interesting because time has given us a completely different perspective. That's exactly what happened when I recently picked up "The Popcorn Report" by Faith Popcorn, first published in 1991.
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The Marketing Minute: Why I Wrote 'Marketing in 17 Minutes'
August 12, 2026 | Brittany Martin, The Marketing Minute
This month, I'm excited to release my first book, "Marketing in 17 Minutes: A Guide to Marketing in the Electronics Industry." After writing 17 (and more) Marketing Minute columns and working with electronics companies, I realized I...
Happy’s Tech Talk #49: Stop! Do You Have a Digital Strategy for the Future?
August 11, 2026 | Happy Holden, Happy’s Tech Talk
I am sure you have been wondering how you will survive this new age of AI, tariffs, China, and the ever-increasing cost of materials and PCB equipment. You cannot just sit back and watch it roll over you. If you wish for your company...
The Chemical Connection: When History Repeats Itself on Diversification
August 4, 2026 | Don Ball, The Chemical Connection
Diversification, as a way to spread out risks, maintain steady cash flows, and sustain stable earnings in unpredictable business environments, is a concept that has long been used by all businesses, not just PCB fabrication. Is it...
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- The Relevance of VeCS as an HDI Process Option by Marcy LaRont
- VeCS HDI Process Technology: Has the Time Come for Broader Adoption? by Joan Tourné
- Life in the Engineering Ecosystem by Kelly Dack
- Designing for a More ‘Intelligent’ and Connected Future with Kristin Moyer
- Who Really Designs the PCB? by Stephen V. Chavez