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AGC's Advanced PCB Material Solutions

AGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.

A 60-Year Legacy of PCB Innovation from IEC

Chris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.

Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards

At APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.

The Global Electronics Association Is Future Forward

John W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.

From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026

Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.

PHOTO GALLERY: Putting in the Work on Standards, Professional Development

Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

Podcast Hits the Mark in a Materials Market

The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.

New EIPC President: Building Strength Through Unity in Europe’s Electronics Industry

Industry veteran Rico Schluter, newly appointed president of EIPC, discusses his decades-long journey through the European PCB industry and his vision for its future. From building advanced manufacturing operations to leading large-scale facility development in Lithuania, Rico shares insights into automation, workforce evolution, and the challenges of scaling production. He emphasizes the urgent need for stronger collaboration across European industry organizations to effectively influence policy in Brussels, particularly around supply chain resilience, trade regulations, and energy-related incentives.

IBM's David Lokken-Toyli: Quantum’s Call to ‘Leap’

What happens when a cutting-edge quantum computer is placed in the middle of a public cafeteria? For David Lokken-Toyli, principal research scientist at IBM Quantum, that image, now a reality at Cleveland Clinic, captures a turning point: Quantum computing is moving out of the lab and into the real world, and getting there will depend not just on physicists, but on an electronics supply chain ready to support entirely new system requirements.

The Next Generation of Leadership: New Student Board Member Aubrey Smith 

At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.

PHOTO GALLERY: APEX EXPO Receptions Are Where the Industry Comes Together

APEX EXPO receptions offer a chance to step away from the booth and connect in a more relaxed setting. From newcomer gatherings to the ice cream social, the show floor reception, and the Golden Gnomes, these events bring attendees together across roles and experience levels. Enjoy this photo gallery of social gatherings. You might find yourself and people you know! It’s a place to reconnect with colleagues, meet people you’ve only known by name, and discover new companies shaping the industry—strengthening relationships and building a sense of community.

John Andresakis Discusses Integrated Thin-film Resistive Foil Technology

John Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.

East Asia's Electronics Dominance and AI with Sydney Xiao

Sydney Xiao, Global Electronics Association – East Asia President emphasizes the region's dominance in electronics manufacturing, particularly with the rise of AI. The association focuses on standards, workforce, technology, and collaboration to help members navigate AI opportunities, highlighting new IC substrate standards and advanced packaging initiatives.

Take the Mic: Photo Chemical Systems: 50 Years Strong

Photo Chemical Systems is celebrating 50 years in the bare board PCB market. David Graves and Jason Averette discuss how they've expanded into assembly, leveraging strong relationships and a customer-centric approach to navigate supply chain challenges. With innovative solutions and future growth strategies, including AI integration and new market ventures, Photo Chemical Systems continues enduring success.

PCB Process Innovations Explained with Rich DePoto

Richard DePoto details Uyemura's expanded PCB process solutions and their enhanced product portfolio, advanced IC substrate technology, and innovative approaches to high-frequency circuit manufacturing. Uyemura is committed to R&D and customized solutions for the electronics industry.

PHOTO GALLERY: A Show Floor Showcase, Part 2

Take a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.

My Top 7 Takeaways from APEX EXPO 2026

I’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.

Women in Electronics Keynote Review: A Life and Career Filled With Humor

In an industry that was dominated by male comedians, Jan McInnis quickly learned an important tip to help her succeed in the business: Don’t ask for permission to be yourself. “Don’t try to be something you’re not,” she said after headlining the Women in Electronics event at APEX EXPO 2026. “They’re paying for you and what you bring to the table, so put your blinders on, and just do your thing.”

Henger Targets AI PCB Challenges With Advanced Plasma Technology

Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.

Electronics Industry Economic Outlook 2026 with Shawn DuBravac

As Chief Economist for the Global Electronics Association, Shawn DuBravac analyzes global economic uncertainties, including geopolitical conflicts and their impact on energy prices. In this interview, he highlights sector-specific growth in defense, aerospace, and AI, contrasting with weaker consumer and industrial markets. Supply chain reconfigurations and emerging technology trends are also discussed.

Ensuring the Next Generation of U.S. Weapons Has Homegrown Electronics

The U.S. has in the works several new weapons to counter emerging enemy threats. These include new warships, fighter aircraft, bombers, submarines, drones and a network of air defenses to defend the entire U.S. against missile and air attacks. And yet the U.S. will be challenged to produce key electronics within these systems known as printed circuit boards (PCBs), which are primarily sourced domestically. While the U.S. government has played a key role in helping to revive the domestic semiconductor industry, with the exception of some funding through the Defense Product Act it has largely ignored domestic production of PCBs.

New, Greener Solutions for Etch: Novel Copper Extraction

“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.

PHOTO GALLERY: A Show Floor Showcase

Take a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.

What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing

The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.
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