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The Global Electronics Association Is Future Forward
John W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Regional Electronics Growth and Initiatives with Gaurab Majumdar
Nolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
John Andresakis Discusses Integrated Thin-film Resistive Foil Technology
John Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.
North American Electronics: Growth & Challenges with Joe Schneinder
Nolan Johnson interviews Joe Schneider of the Global Electronics Association about North American electronics industry trends. Schneider discusses the surge in US data center demand, the association's work on AI standards, and strategic focus on aerospace and defense. The conversation addresses workforce development and capacity challenges, highlighting Global Electronics Assiciation's commitment to supporting member growth and knowledge acquisition in 2026.
Ensuring the Next Generation of U.S. Weapons Has Homegrown Electronics
The U.S. has in the works several new weapons to counter emerging enemy threats. These include new warships, fighter aircraft, bombers, submarines, drones and a network of air defenses to defend the entire U.S. against missile and air attacks. And yet the U.S. will be challenged to produce key electronics within these systems known as printed circuit boards (PCBs), which are primarily sourced domestically. While the U.S. government has played a key role in helping to revive the domestic semiconductor industry, with the exception of some funding through the Defense Product Act it has largely ignored domestic production of PCBs.
What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing
The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.
Global Electronics Association Advocacy Update
Chris Mitchell, chief advocacy officer for the Global Electronics Association, details the association's enhanced advocacy and industry intelligence initiatives, including new hires and improved data analysis. He discusses critical global trade issues, recent tariff rulings, and the importance of strengthening North America's electronics ecosystem through USMCA collaboration.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.
APEX EXPO Opens Today With Ribbon Cutting and Sold-Out Show Floor
APEX EXPO officially opens today with a ribbon-cutting ceremony welcoming attendees onto the sold-out show floor in Anaheim, California. Standards committee meetings and professional development courses have been underway since the weekend, but Tuesday marks the official opening of the exhibition as more than 400 exhibitors prepare to showcase their latest equipment, materials, and technologies across 140,000 square feet of exhibit space.
Kevin O’Hanlon: A New Voice for Electronics on Capitol Hill
What do KFC, video games, and the Global Electronics Association have in common? The answer is Kevin O’Hanlon, the Association’s new vice president of North American Government Relations. Kevin’s career has included lobbying roles across multiple industries on Capitol Hill, including, most recently, six years at Samsung, a massive South Korean conglomerate. In his new role, Kevin outlines a mission centered on strengthening North American electronics manufacturing while maintaining a realistic global perspective.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Cue up “The Final Countdown, the monster ’80s hit song by Swedish band Europe, because it’s almost APEX EXPO week. Side note: When it comes to rock anthems, I’m more of an “Eye of the Tiger” man, myself. Some folks are already arriving in Anaheim, as standards development committee work starts as early as tomorrow. The show continues through Thursday, March 19.
I-Connect007 to Launch Weekly Show & Tell Newsletter Series Featuring APEX EXPO Highlights
Building on our tradition of delivering comprehensive coverage of APEX EXPO 2026, I-Connect007 will present a five-episode Show & Tell Newsletter series, arriving in subscribers’ inboxes each Friday, March 27 to April 24. The special series will highlight key moments from the Global Electronics Association’s annual trade show, offering readers an inside look at the people, companies, and ideas shaping the electronics manufacturing industry.
UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging
The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.
A Critical Moment for Europe’s Electronics Ecosystem
As Europe reexamines its industrial strategy amid geopolitical shifts, how does electronics become a critical priority? In this interview, Alison James, senior director Europe, government relations, at the Global Electronics Association, explains how industry advocacy is influencing the review of the European Chips Act, and why the conversation must extend beyond semiconductors to include PCBs, EMS, and complete systems. With 27 member states to align, can policy move fast enough to secure Europe’s electronics future?
After IEEPA: What Electronics Companies Should Know About Tariff Refund Strategies and Section 122
The U.S. Supreme Court’s recent decision striking down tariffs imposed under the International Emergency Economic Powers Act (IEEPA) opens the door to potential refunds for electronics companies and signals a rapid pivot to alternative trade statutes, setting the stage for a volatile 150-day period that could significantly affect global electronics supply chains. Trade and electronics industry leaders gathered for a webinar hosted by the Global Electronics Association on Feb. 24 to learn more about the landmark U.S. Supreme Court decision.
Electronics Trade in a Persistent Tariff Environment
Tariffs affecting the electronics sector were largely still in place at the end of 2025, even as the pace of new announcements slowed, and several electronics-relevant investigations and legal questions pushed key decisions into 2026. For companies operating global electronics supply chains, tariffs are no longer a short-term disruption; they are part of the operating environment. The costs facing electronics manufacturers are no longer limited to the tariff rates we see in headlines.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
A National Strategy to Ensure Greater Use of Trusted Commercial Electronics
The Department of Defense’s “commercial-first” directive aligns with longstanding defense procurement practices, with every major defense system now relying heavily on commercial-off-the-shelf (COTS) electronics. But the challenge is ensuring COTS electronics can be scaled, surged and, most importantly, trusted as one element within a broader, deliberate national strategy. Today’s commercial electronics ecosystem is overwhelmingly concentrated in Asia and increasingly dominated by China.
PCBAA Sets Its Priorities for 2026: Support in the House and Senate
David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In the continuation of this interview, David talks about the ways his organization is aligning its priorities with Washington, in particular, the Executive Branch. It might feel like a snail’s pace, but progress could mean financial support and more domestic security, even for the smaller companies.
Navigating the Shift: Key Trends Shaping Growth in AI and Electronics Through 2026
Global Electronics Association's Chief Economist Shawn DuBravac offers guidance on how companies can successfully navigate challenges and seize new opportunities in this dynamic industry. First, he says, economic growth will remain dangerously narrow. Prosperity will concentrate on artificial intelligence infrastructure, defense electronics, and high-income consumer spending, while companies outside these lanes face headwinds.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
Is Washington Ready to Get Serious About PCBs?
David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In part one of this interview, he reflects on how a “perfect storm” during the COVID-19 pandemic actually ignited the conversation that has allowed PCBAA to flourish: Years of advocacy, the shock of COVID-era supply chain disruptions, and the long road to the CHIPS Act have helped to reshape the federal mindset on industrial policy.
MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics
The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Lately, I’ve been thinking a lot about storytelling. Partly because I’m reading "Creativity, Inc.," by Ed Catmull, and partly because it’s impossible to separate Pixar’s success from the power of the stories it tells, both on screen and behind the scenes. Everything matters to Pixar—from the technology to the leadership—but what makes Pixar truly special is the stories it tells about human emotions. They make our human complexity understandable.
USPAE Grants ‘Greater Access’ to Defense Electronics Manufacturers
Chris Peters, co-founder of the U.S. Partnership for Assured Electronics and expert on manufacturing supply chains, recently announced he would be stepping back from his role. I first met Chris in the spring of 2020, when SMT007 Magazine interviewed him for the July 2020 issue. I was pleased that Chris took the time to reflect on the USPAE, past present and future, and his optimism is infectious.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it. Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
Where Electronics Manufacturing Turns for Trusted Technical Insight
In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
Restoring U.S. Industrial Agility: Nurturing Domestic UAV Supply Chains
Unmanned aerial vehicles (UAV) illustrate the risk of globally dispersed electronics supply chains. But they also offer an opportunity for the U.S. to reimagine World War II’s “freedom’s forge” by building domestic electronics and component manufacturing that is hardwired for agility, speed, scalability and resilience.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Happy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”
I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.
Advance Your Electronics Career in 2026: Upcoming Instructor-Led Courses from Electronics U
Staying competitive in the electronics industry requires continuously strengthening your technical expertise. Electronics U is excited to present a new lineup of expert-led, online courses designed to elevate your skills in PCB design, electronics assembly, wire harness design, program management, and more. Whether you're looking to build foundational knowledge or expand into specialized applications, these immersive, instructor-guided sessions will help you master the tools and techniques that today’s leading companies rely on.
Happy New Year from the I-Connect007 Staff
The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.
Voices of the Industry Podcast Explores the Evolving Role of Inspection Systems in EMS Manufacturing
Inspection technology continues to play a pivotal role in the evolution of electronics manufacturing services, and the latest episode of Voices of the Industry brings that conversation into sharp focus. Hosted by I-Connect007’s Nolan Johnson, this episode features Joel Scutchfield of Koh Young, a recognized leader in 3D measurement-based inspection systems.
Denny Fritz: A Hall-of-Fame Career in PCBs
From DuPont to the Navy’s top electronics programs, Defense Speak Interpreted columnist Dennis “Denny” Fritz has devoted his career to advancing defense technology and collaboration. In this interview, Denny reflects on decades of leadership, service, and innovation, offering timeless advice on staying technically active and leading with purpose.
CMMC 2.0: What You Need to Know
Tenets of the Department of Defense's (DoD) Cybersecurity Maturity Model Certification Program (CMMC) 2.0 went into effect on Nov. 10. What are the primary differences between 1.0 and 2.0 compliance, and what exactly must be in place now? CMMC 2.0 is now being written into DoD contracts and enforced through DFARS (Defense Federal Acquisition Regulation Supplement), with a three-year phased rollout. For PCB and electronics manufacturers in the defense supply chain, this is now a real gate to doing business with the DoD, not a “nice to have.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
What a year it’s been! I don’t think anyone could have anticipated the level of shake-up that was to come on the global trade scene when U.S. President Donald Trump came into his second term in January, but the drama that has ensued rivals anything ever aired on “The Apprentice.” However, I am somewhat heartened by our current position compared to how things felt in Q2 of this year. Much remains to be worked out, but as we sprint into the new year, there are three things I know for sure: 1) Working in tech is never dull—you will not be bored in 2026; 2) Expect to work very hard; and 3) Business, like life, will go on no matter what. I hope you enjoy my picks for week: all good reads for different reasons. Happy New Year!
Merry Christmas from I-Connect007!
The I-Connect007 offices are closed today, in observance of the Christmas holiday. As part of the Global Electronics Association, the offices remain closed through New Year’s Day. I-Connect007 will still publish daily and weekly newsletters (with the exception of Christmas and New Year’s Day). Some staff members will still be checking email. Just for fun, we thought we’d share a bit of Christmas tradition about the gingerbread house. You’ve likely built one at some point and perhaps wondered how this tradition originated.
SMTA Space Coast: What's Needed to Modernize Defense Solder Standards
Long-time lead-free solder investigator, Denny Fritz, hit the SMTA Space Coast Expo in November to drum up support for an initiative to include lead-free solder in milaero-based printed circuit board assemblies. In this interview, Denny provides background on the genesis of the “consider all solders” project and why it matters to continue leading this effort.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Before diving into this week’s must-reads, I want to spotlight the incredible batch of interviews our team captured at productronica. They go beyond the quick booth chitchat and dig into the most pressing topics in electronics manufacturing. We spoke with companies and leaders who are shaping what happens next, and the conversations touch on the challenges and innovations that matter most to the industry today.
The Next Five Years of Thermal Substrates, Ceramics, and Thick-film PCBs
If you want a clean view of where thermal substrates and ceramic/thick-film electronics are headed, follow the heat. Power density is moving up and to the right across industries: EV traction inverters, fast chargers, AI data centers, radar, satellite payloads, medical imaging, and high-brightness LEDs. The next five years will be defined by designs that treat thermal performance as a first-order constraint, not an afterthought. Here’s what that means in practice.
I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest
Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.
Jesse Vaughan: A Basketball and PCB Industry ‘Fanatic’
A third-generation PCB technologist and lifelong basketball enthusiast, Jesse Vaughan shares how family legacy, grit, and a love of innovation shaped his path from the court to the cleanroom. In this interview, the Beyond the Board columnist reflects on risk-taking, resilience, and the boundless future he envisions for the U.S. PCB industry
I-Connect007 Closes for Thanksgiving Day
I-Connect007 recognizes Thanksgiving Day and its office will be closed Nov. 27–28, 2025. The Thanksgiving holidays, as celebrated across North America, trace their roots to early harvest celebrations, expressions of gratitude, and moments of national significance. In Canada, Thanksgiving is often linked to explorer Martin Frobisher’s 1578 Arctic expedition, where he held a ceremony giving thanks for a safe passage—decades before the Pilgrims arrived in North America.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Were you one of the lucky ones who made it to Europe’s largest electronics trade show this week? By all accounts, this massive event was buzzing with new technologies, packed booths, and plenty of tired feet by the end of each day. So, if you’re heading home from productronica (or, like me, just enjoying the end of a busy week), now’s the perfect time to unwind a bit. Settle into that airplane seat (or office chair), grab a snack, and catch up on some great reads from I-Connect007.
The Purity of Certification
The global context has changed dramatically. The United States has imposed tariffs on China and other countries with the goal of protecting its market and reducing dependence on distant supply chains. This measure has triggered a strategic realignment in manufacturing: Many companies are now seeking to establish operations closer to their main customer.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Real Time with... SMTA International 2025: Navigating Cybersecurity and Compliance in Manufacturing with Integris
Marcy LaRont introduces Michael Doucette from Integris at the SMTAI show, where they discuss the significance of networking and the new CMMC level 2.0 compliance requirements for manufacturers with DOD contracts. Integris shares their approach to technology assessments and highlights common cybersecurity risks. They emphasize the shift to cloud services and provide practical cybersecurity tips, underscoring the increasing importance of cybersecurity in IT strategies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
A New Era for Global Trade and Electronics
The global trade system is undergoing an enormous, systemic paradigm shift. For decades, the World Trade Organization (WTO), with the support of the United States, its traditional European allies, and many other nations, stood at the center of efforts to create fairer, more predictable, and rules-based commerce. Today, however, that model is giving way to a more fragmented reality—so far U.S.-driven—in which individual nations and blocs are striking deals and imposing a variety of rules of their own liking.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.
Waging the Battle for American PCB Reshoring
Legislation is shaping global trade, tariffs, and sustainability and environmental regulations. David Schild of PCBAA discusses exactly where the U.S. stands in its efforts to reshore printed circuit board manufacturing for critical industries. This conversation at PCB West occurred on the first day of the federal government’s shutdown, so it seemed especially timely to hear David's thoughts and insights on how the current political climate is affecting efforts to achieve the U.S. industry’s reshoring goals.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Light-curable Solutions for Reliable Electronics in Space Applications
Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
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