Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Airbus Projects Resilient Growth of Services Market in the Next 20 Years
In its latest Global Services Forecast (GSF), Airbus anticipates that the total demand for services will see a 10% year-on-year increase in 2025, and...
RTX's Raytheon Begins Initial Production of SharpSight Surveillance Radar
Raytheon, an RTX business, has launched the initial production of its new SharpSight multi-domain surveillance...
L3Harris Announces New Variants of its VAMPIRE System
L3Harris Technologies has expanded its VAMPIRE™ system, demonstrating the company’s ability to swiftly respond to the U.S. Department of War and...
Saab, the Swedish Armed Forces Extend Gripen Maintenance Contract
Saab and the Swedish Armed Forces have extended an existing contract and Saab has received an order for support- and maintenance services for Gripen...
Muon Space Awarded $44.6M Space Force SBIR Phase III Other Transaction Authority (OTA) Agreement
Muon Space, a leading provider of end-to-end space systems specializing in mission-optimized satellite constellations, announced it has been awarded...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 10, 2025 | Nolan Johnson, I-Connect007
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
October 9, 2025 | I-Connect007
I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
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