I-Connect007 to Launch Weekly Show & Tell Newsletter Series Featuring APEX EXPO Highlights
March 12, 2026 | I-Connect007Estimated reading time: 1 minute
Building on our tradition of delivering comprehensive coverage of APEX EXPO 2026, I-Connect007 will present a five-episode Show & Tell Newsletter series, arriving in subscribers’ inboxes each Friday, March 27 to April 24.
The special series will highlight key moments from the Global Electronics Association’s annual trade show, offering readers an inside look at the people, companies, and ideas shaping the electronics manufacturing industry.
Each issue will feature exclusive interviews with special guests, Real Time with… APEX EXPO 2026 video interviews with our premium-level showcase sponsors and other industry leaders, profiles of companies exhibiting at the show, and coverage of the award winners. Try to find yourself in our weekly photo galleries too!
Subscribers don’t need to take any action. The Show & Tell Newsletter will automatically appear in your inbox each Friday.
Whether you attended the show or couldn’t make it, you’ll enjoy this unique opportunity to experience the insights, connections, and innovation that emerge when the electronics industry gathers to learn, share, network, and do business.
Interested in reaching thousands of electronics industry subscribers through this special series? Exclusive and limited sponsorship opportunities are now available. Contact Barb Hockaday to learn more.
To stay up to date on electronics industry news, visit iconnect007.com. For APEX EXPO-related content, including all video interviews, visit realtimewith.com beginning March 17.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.