I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Estimated reading time: 3 minutes

If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once.

My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging. It starts with advanced materials, including an important roundtable discussion with Ventec, and the final installment in our podcast series with Isola. I also mention a conversation with John Johnson of ASC about the recent SMTA conference in Arizona. I hope you’ll enjoy my short interview with Dennis Donovan, an Emerging Engineer who is fully invested in the electronics industry. He’s a name to watch for in the coming years. I wrap up with the latest column from Ryan Miller at NCAB, writing about one of today’s hottest topics: reliability in harsh environments starts upstream in design.

We’re more than a month into spring, and I hope the flowers are blooming wherever you find yourself in the world. As always, there’s more content across I-Connect007’s magazines, newsletters, podcasts, and educational resources. Take a few minutes to dig in.

Roundtable: Advanced Materials
Published April 27

Advanced materials are no longer a niche conversation; they’re central to everything from AI to high-performance computing. This roundtable led by Marcy LaRont digs into low-loss resins, glass supply, and copper availability, all under increasing global pressure. Material constraints and supply chain realities may hit critical mass sooner than expected, forcing OEMs and fabricators to rethink sourcing, design, and long-term strategy.

From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series With Focus on Innovation
Published April 30

This wrap-up of I-Connect007’s PCB materials series brings the conversation full circle, from foundational materials to the innovations now driving the next generation of electronics. The series reinforces that materials aren’t just a starting point; they shape performance, reliability, and manufacturability. No matter what sector of the industry you’re in, take the time to stay informed about what’s happening in the materials world.

ASC’s John Johnson Bullish on the U.S. and High-Tech PCBs
Published April 28

There’s cautious optimism about a U.S. PCB resurgence, but it comes with caveats. At the conclusion of the SMTA UHDI Symposium, Marcy LaRont and John Johnson identified the positive signs from the event, including increased investment, government involvement, and new facilities. John warns about fragile domestic infrastructure, including limited copper foil and glass supply. Momentum is building, he says, but without sustained support and coordinated effort, the U.S. risks falling short of what advanced PCB manufacturing demands.

Meet Emerging Engineer Dennis Donovan, Kratos Space Commercial
Published April 29

Here’s the latest in my series of interviews with some of today’s brightest stars, new to the electronics industry. He may be young, but Dennis already has a stack of degrees on his pedigree, and is working toward more. He’s exactly the type of engineer the industry will find beneficial—serious about his craft and eager to contribute. Keep an eye on Dennis in the coming years!

Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Published April 30

When we talk about harsh environments, it’s easy to picture aerospace, but the reality is much broader. In this NCAB column, Ryan Miller points out that most failures don’t happen suddenly; they start quietly inside the board. The difference between success and field failure often comes down to design margin. Reliability is built in from the start through material choices, stackup, and process discipline.