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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Happy New Year; Now Back to Work
Welcome back! It’s January again, and it’s a brisk 10 degrees here in Atlanta. It’s so cold here that socialites have abandoned the veranda and taken their mint juleps into the parlor.
Yes, it’s time to get back into work mode. We ended the year on a good note, with unemployment down and almost 3 million jobs created in the first 11 months of 2015—the most for any similar period since 1999. There are still too many people working part-time who would like a full-time job, but the trend looks positive.
Show Time
During the week of February 22–26, it’s off to San Diego for IPC APEX EXPO and the Design Forum. (And three cheers for IPC moving APEX back to “America’s Finest City.” It’s hard to have a bad day in San Diego.) Appropriately, the Design Forum kicks off the week, with a keynote by Carl Schattke, a PCB design engineer with Tesla Motors. How many PCBs can you find in a Tesla?
To read this entire column, click here.
More Columns from The Shaughnessy Report
The Shaughnessy Report: Back to the FutureThe Shaughnessy Report: The Designer of Tomorrow
The Shaughnessy Report: A Stack of Advanced Packaging Info
The Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders
The Shaughnessy Report: Mechatronics—Designers Need to Know It All