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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Madhavan Swaminathan: The Power of Power Integrity
Dr. Madhavan Swaminathan is the Joseph M. Pettit Professor in Electronics at Georgia Tech and a co-author of Power Integrity Modeling and Design for Semiconductors and Systems. Dr. Swaminathan and Guest Editor Eric Bogatin discuss the issues surrounding power integrity and the need for accurate measurement tools, as well as his work as CTO for E-System Design.
Click here to listen.
More Columns from The Shaughnessy Report
The Shaughnessy Report: Back to the FutureThe Shaughnessy Report: The Designer of Tomorrow
The Shaughnessy Report: A Stack of Advanced Packaging Info
The Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders
The Shaughnessy Report: Mechatronics—Designers Need to Know It All