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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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The Shaughnessy Report: NI Week Wrapup
National Instruments recently held its annual NI Week in Austin, Texas and, despite the unsteady economy, attendance increased from last year. Bhavesh Mistry, marketing manager for NI Multisim, explains how this event drew so many engineers to the hundred-degree Texas heat, and why NI's hardware and software are a perfect match.
Click here to listen.
More Columns from The Shaughnessy Report
The Shaughnessy Report: Back to the FutureThe Shaughnessy Report: The Designer of Tomorrow
The Shaughnessy Report: A Stack of Advanced Packaging Info
The Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders
The Shaughnessy Report: Mechatronics—Designers Need to Know It All