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Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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The Shaughnessy Report: Per Viklund and How-Siang Yap on the Mentor/Agilent RF tool partnership
Per Viklund of Mentor Graphics and How-Siang Yap of Agilent EEsof sat down with Design007 at PCB East to discuss the companies' recent RF tool partnership. Now, Agilent's ADS RF tool can be used with Mentor Graphics' Expedition and BoardStation PCB design tool, Click here to find out how this collaboration can help eliminate months of writing custom code to transfer data from RF to the PCB layout environment.
More Columns from The Shaughnessy Report
The Shaughnessy Report: The Designer of TomorrowThe Shaughnessy Report: A Stack of Advanced Packaging Info
The Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down
The Shaughnessy Report: Watch Out for Cost Adders
The Shaughnessy Report: Mechatronics—Designers Need to Know It All
The Shaughnessy Report: All Together Now—The Value of Collaboration