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Incap, Rantelon Partner on RF and Electronic Warfare Technologies for Unmanned Systems

11/12/2026 | Incap
Incap Electronics Germany GmbH and Rantelon OÜ are establishing a sales and business development cooperation to bring advanced radio-frequency and electronic warfare technologies to manufacturers and developers of unmanned systems in the German-speaking market.

NOTE Secures SEK 80–100M Security and Defence Contract for 2027 Delivery

11/12/2026 | NOTE
NOTE has secured additional business with an existing customer within Security & Defence, with an expected sales value of approximately SEK 80-100 million for delivery during 2027.

MacDermid Alpha Electronics Solutions’ Dr. Ravi Bhatkal Recognized by India’s VP for Advancing Electronics Manufacturing Education

11/12/2026 | MacDermid Alpha Electronics Solutions
Dr. Ravi Bhatkal, Vice President, Strategy, India, at MacDermid Alpha Electronics Solutions, has been honored for his contributions to establishing a production-grade surface mount technology (SMT) facility at Kongu Engineering College in Tamil Nadu, India, advancing hands-on technical education and workforce development.

Powering the Future: Why Engineers Are Switching to Ceramic Substrates

11/12/2026 | Brian Buyea -- Column: Powering the Future
Walk into any design review, whether it’s for an EV inverter, a radar system, or a high-frequency amplifier, and you’ll hear the same concern repeated in different ways: “How are we managing the heat?” That question, more than anything else, is driving one of the most important material shifts happening in electronics today. Engineers are moving deliberately and increasingly toward ceramic substrates. Not because they’re trendy, but because they solve problems that traditional materials simply can’t solve anymore.

From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.
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