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Technica USA recently attended the SEMICON West Expo, where company representatives Jason Perry, President; Peter Chen, Equipment Service Manager; and Frank Medina focused on strengthening relationships with customers and supply partners while preparing for the company’s participation in SEMICON West 2027 that will take place March 30-April 1, in Phoenix, Arizona.
The team attended the event with two primary objectives: to engage with existing and prospective customers and supply partners, and to establish a foundation for Technica USA’s expanded participation in SEMICON West 2027.
“Our attendance this year was important because it gave us the opportunity to connect with current and prospective supply partners and develop new relationships that support our expansion into the microelectronics and semiconductor markets,” said Jason Perry, President of Technica USA. “We already have established partnerships with companies whose product portfolios serve the PCB assembly market and have strong applications within the semiconductor industry. These relationships create opportunities for us to extend our reach and provide additional value to our customers and partners.”
Peter Chen, Equipment Service Manager, attended SEMICON West to meet with equipment manufacturers and suppliers with whom Technica USA is developing partnerships to provide domestic service and support for their products in the United States.
“My role is to work with international equipment suppliers that need reliable, U.S.-based service and technical support for their products,” Chen explained. “We have already hired bilingual service technicians who are undergoing training on selected equipment platforms. Our goal is to continue expanding our technical capabilities and strengthen Technica USA’s position as a trusted service and support partner in this growing market.”
Perry emphasized that the company’s investment in service capabilities is an important step toward broader strategic partnerships.
“The work Peter and his team are doing represents an important step in our expansion strategy,” Perry said. “By developing local service and support capabilities, we can strengthen our relationships with equipment manufacturers and create opportunities to provide additional sales and product support as the semiconductor market continues to grow.”
As part of this strategy, Technica USA has decided to participate in SEMICON West 2027 alongside its longtime partner in the PCB assembly market, ASMPT.
At SEMICON West 2027, ASMPT will showcase its SIPLACE CA2, a system designed to bring advanced wafer-to-placement technology directly to the surface-mount technology (SMT) production line.
Combining the capabilities of an SMT placement machine and a die bonder, the SIPLACE CA2 can process both surface-mount devices (SMDs) supplied through changeover tables and feeders and dies taken directly from a sawn wafer—all within a single production step.
By integrating die bonding into the SMT production process, the SIPLACE CA2 eliminates the need for separate, dedicated die-bonding equipment for compatible applications. This approach can help manufacturers streamline production, reduce equipment requirements, and simplify material handling. With reduced operator intervention, advanced connectivity, and integrated data utilization, the system is designed to support the evolving demands of the Intelligent Factory.
The technology also represents an opportunity to demonstrate how innovations traditionally associated with semiconductor manufacturing can be integrated into established SMT production environments.
Looking Ahead to 2027
Perry concluded, “April will be an exciting and busy month, with SEMICON West, booth # 3844 and APEX, booth # 3910 taking place in consecutive weeks. We are very excited about the opportunity to showcase Technica USA and the outstanding companies we partner with across the PCB fabrication, PCB assembly, and semiconductor markets. Our participation reflects our commitment to building strong industry relationships, expanding our service capabilities, and connecting our customers with innovative technologies that support their evolving manufacturing needs.”
As a subsidiary of EMC Taiwan, Technica USA looks forward to continuing to build on its established industry relationships while developing new partnerships that support the company’s growth across the microelectronics manufacturing ecosystem.
