The Marketing Minute: Marketing Is a Team Sport
The Right Approach: Old Philosophies, New Tools
Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging
The October 2026 issue of I-Connect007 Magazine is now available, featuring MKS Inc., our cover sponsor. Marcy LaRont interviews President and CEO John Lee, while related coverage examines the company’s efforts to bring advanced technologies to manufacturing challenges in the PCB, assembly, and semiconductor supply chains.
Our coverage from Thailand examines three Chinese companies investing in the country, with rapid factory ramp-ups and progress toward profitable operations. LaRont also speaks with Accurate Circuit Engineering’s James Hofer about PCB prototype fabrication and the company’s readiness to support U.S. defense and aerospace requirements.
The technical columns connect design choices to manufacturing results: Barry Olney examines inductance and its effects on signal and power integrity; Kelly Atay explains why designers should consider quoting from the start; and Brian Buyea explores ceramic substrates for connectivity and heat management, while Anaya Vardya looks at flexible sensors in smart dental retainers.
The issue also addresses the risks of implementing AI in factories, continuing Sean Patterson’s series on shop-floor applications and featuring Steve Williams’ reminder that quality systems require rigor. PCBAA discusses government support for U.S. PCB manufacturing, and new columnist Michael Gleason of GreenSource Fabrication joins the contributor team.
